How to design double head Pogo Pin?

Double head Pogo Pin is a bidirectional spring-loaded connector with telescoping functionality on both ends. It is widely used inboard-to-board connections,modular device interfaces, and bidirectional charging/data transfer applications. Its design must balance electrical performance, mechanical durability, and bidirectional contact stability. Below is a Double head Pogo Pin detailed explanation of its structure, material selection, parameter optimization, and validation processes.

1. Structural Design and Core Components

1. Basic Structure(Figure 1)

• Dual Plungers: Both ends feature tapered plungers (15–30° angles) to ensure full contact with the inner barrel wall during compression, minimizing contact resistance (typically ≤20mΩ)

• Central Spring: Made of stainless steel (SUS304) or music wire, with a spring rate of 0.8–1.5N/mm, providing bidirectional contact force (80–150gf per end) .

• Barrel: Brass tube with nickel plating (3–5μm) and gold plating (0.5–1μm), inner diameter tolerance ±0.02mm, ensuring smooth plunger movement.

• Insulation Sleeve: PA66 or LCP material for electrical isolation, rated for ≥500V AC.

2. Key Design Considerations

• Symmetry Control: Plunger length deviation ≤0.05mm to avoid uneven contact.

• Spring Preload: Pre-compress the spring to 30–50% of total travel (e.g., 1mm preload for 3mm total travel) to ensure initial contact force.

• Anti-Binding Design: Barrel inner walls polished to Ra ≤0.4μm, with fluorinated lubricant to reduce friction.

2. Material and Process Selection

1. Material Specifications


2. Pogo pin Manufacturing Processes

• Precision Stamping: CNC machining for plunger tips with ±1° angle tolerance and Ra ≤0.8μm.

• Laser Welding: Spring-to-plunger fixation with 0.3–0.5mm weld spots, strength ≥50N.

• Automated Assembly: High-precision fixtures (±0.01mm) for barrel, spring, and plunger assembly.


3. Electrical and Mechanical Performance Optimization

1. Electrical Parameters

• Contact Resistance: ≤20mΩ per end (tested at 100mA, 4-wire method).

• Insulation Resistance: ≥100MΩ (500V DC, 90% RH).

• Current Rating: 3A continuous per end (5A total), 10A pulse (1s) .

2. Mechanical Performance

• Durability: ≥10,000 cycles (2mm travel, 2Hz), contact resistance drift <10%.

• Vibration Resistance: Passes 10–2000Hz random vibration (5Grms), momentary disconnection <1μs.

• Environmental Robustness: Operational range -40°C to 125°C, 48hr salt spray test compliant.

3. Specialized Variants

• High-Current Type: 1.2mm plunger diameter, 200gf spring force, 10A continuous current.

• Waterproof Type: Silicone O-ring (20% compression) for IP67 rating .

• Miniature Type: Compact design (Φ1.5mm×6mm) for TWS earphone charging.


4. Testing and Compliance

1. Critical Tests

• Cycle Testing: 50,000 insertion cycles with post-test resistance and spring force measurement.

• Thermal Shock: 100 cycles (-40°C ↔125°C) to validate thermal expansion effects.

• Current Load: 5A bidirectional load for 1 hour, temperature rise ≤30°C.

2. Industry Standards

• Electrical: IEC 60512-101 (contact resistance), IEC 61076-2 (connector standards).

• Mechanical: EIA-364-09 (cycle life), MIL-STD-202 (vibration).

5. Application Scenarios

1. Consumer Electronics

• Foldable smartphone hinge modules for bidirectional USB 3.1 (10Gbps) signal transfer .

2. Industrial Equipment

• Detachable robot joint interfaces for power and data, resistant to dust/vibration.

3. Medical Devices

• Endoscope quick-connect modules with autoclave compatibility (134°C/3bar).

Design Case Study:

A drone battery module uses Φ2.0mm dual-sided Pogo pins with 120gf contact force per end, enabling 10A fast charging and CAN bus communication. It achieves 10,000 cycles and passes MIL-STD-810G military testing.

Applications of Double Head Pogo Pins

Below is a detailed overview of its key use cases:

1. Consumer Electronics

• Foldable Devices: Enable bidirectional signal transmission(e.g., USB 3.1 10Gbps) and power delivery in smartphone/pad hinge modules, ensuring stable communication during screen folding.

• Wireless Charging: Serve as bidirectional charging contacts for TWS earbuds, smartwatches, and other wearables, withstanding frequent mating cycles without metal wear.

• Modular Interfaces: Provide quick-connect solutions for detachable components like gaming controllers or camera modules, enhancing device expandability.

2. Industrial Equipment

• Robotic Joints: Deliver simultaneous power and data transfer(CAN bus/Ether CAT) in modular robotic arms or AGVs, resistant to vibration and dust.

• Automated Testing Fixtures: Act as high-density PCB test probes, ensuring reliable contact over tens of thousands of test cycles.

3. Medical Devices

• Endoscope Modules: Support quick-disconnect interfaces compatible with autoclave sterilization (134°C/3bar) for hygienic environments.

• Portable Monitors: Enable repeated plug-and-play connections for sensors and monitors, maintaining high signal fidelity.

4. Drones & Robotics

• Battery Hot-Swapping: Facilitate 10A fast charging and real-time communication (e.g., battery status) in drone battery systems, compliant with MIL-STD-810G.

• Sensor Interfaces: Secure shock-resistant connections for LiDAR or IMU modules during flight or motion.

5. Automotive Electronics

• In-Cabin Modules: Power and data interfaces for navigation systems/dashcams, operational from -40°C to 125°C.

• Battery Management Systems (BMS): Connect EV battery modules with vibration-resistant signal monitoring.

6. Test & Measurement

• Semiconductor Testing: Enable micron-level precision in wafer probe cards for bidirectional signal acquisition.

• Lab Instruments: Simplify calibration via modular interfaces in multi-channel data acquisition systems.

Key Advantages

1. Bidirectional Connectivity: Independent telescoping ends adapt to misaligned or floating mating surfaces.

2. High Reliability: 50,000+ mating cycles (per EIA-364-09) with stable contact resistance (≤20mΩ).

3. Environmental Resilience: IP67 waterproofing (with silicone seals), salt spray resistance, and 5Grms vibration tolerance.

4. Miniaturization: Compact designs down to Φ1.5mm for space-constrained applications.

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